The flexible copper clad substrate (FCCL) is composed of three materials: copper foil, adhesive and PI film through high-precision coating technology. It has the characteristics of high temperature resistance, high insulation and high deflection. Widely used in FPC manufacturing.
It is made of polymer polyimide material, epoxy resin adhesive system and pure copper base material, and the fire rating reaches 94V-0
The welding process acts to isolate the air and prevent the oxidation of the metal surface
With anti-oxidation, thermal shock, moisture resistance
Low thermal resistance and fast propagation
We have a strong R&D team, which can be developed and customized according to customer needs or drawings or samples provided
We have our own testing laboratory and the most advanced and complete testing equipment to ensure the quality of our products.
We really look forward to meeting you and getting to know your business!